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Electroless nickel palladium immersion gold (ENEPIG) technology is in the structure of nickel layer, palladium layer and gold layer. There is an additional layer of palladium between nickel and gold. In the deposition reaction of replacement gold, electroless palladium plating layer will protect the nickel layer from excessive corrosion caused by cross replacement gold. While palladium prevents corrosion caused by replacement reaction, make full preparations for immersion gold.

Process :

Load/unload –Drying–Hot rinse –Rinse 2–Rinse 1–Drag out rinse– Immersion Au–Rinse 2–Rinse 1–Electroless Pd–Rinse 2–Rinse 1–Electroless Ni–Etching solution for Ni tank– Electroless Ni– Rinse 2–Rinse 1–Post dip—Rinse 2–Rinse 1–Activator –Pre dip—Rinse 2–Rinse 1–Micro etch–Rinse 2–Rinse 1–Degrease –Rinse 2–Rinse 1–Drag out rinse —Galv Au–Rinse 2–Rinse 1–Pre dip–Rinse 2–Rinse 1–Galv Ni–Pre dip